Sensing, Connectivity, Power
CoInnovateCS is focused on exciting markets that will shape communications and connectivity over the next decade.
Promising engaging talks and interactive panels, CoInnovateCS 2021 will run across 3 days where we will delve into all markets by exploring our our three themes: Sensing, Connectivity and Power.
CoInnovateCS is the place to hear from and to collaborate with market leaders during the virtual CoSynergy workshop where we will explore market driven challenges and opportunities across the compound semiconductor supply chain.
Sensing connects us to the world around us. 3D sensing technologies have been integrated into millions of mobile devices, LiDAR technologies allow autonomous vehicles to navigate safely in the complex world, AR/VR/MR Extended Reality technologies enhance our interactivity, and biometric sensors are continuing to provide healthier lifestyles. Compound semiconductors that drive each of these technologies have demonstrated the ability to improve our lives, but how do we ensure that these technologies are ready to scale? What are the industry challenges facing sensing technologies?
Connectivity is our constant in the always-on world of today. That demands 5G wireless systems, telecom and datacom networks, and the datacenters that provide the content – all to work seamlessly. Compound semiconductor technologies are at the heart of this connectivity and have enabled our connected world – we are in the midst of a technology revolution that hasn’t happened for 20 years. And today, networks and systems and technologies all need to be designed to work together to provide optimum performance in ways like never before. What are the challenges to each of these? How do we get the most from the systems and the technologies?
Power technologies are rapidly becoming a major factor in energy conservation. It’s more than just automotive and datacenters that require high power, high efficiency components. And it takes more than just better materials to make these applications tick – it takes a lot of SiC wafers. Each EV consumes a significant amount of wafer area and a significant amount of existing fab capacity. In order to take full advantage of these technologies, we are going to have to ensure that SiC and GaN/SiC substrates, materials, and process capabilities are able to scale to meet this demand. How do we get there from here and ensure that we can electrify the world?